Wafer cleaning is a critical process in semiconductor manufacturing for removing contaminants, particles, and residues from the surface of silicon wafers. This process ensures the reliability and functionality of integrated circuits (ICs) and other semiconductor devices.
Extra durability
Cleaning agents can include acids, various solvents, and water, and these residues might be present, thus requiring extra durability from measurement probes.
Vaisala offers corrosive resistant probes also without metal wetted parts, specially tailored for the wafer cleaning process, tolerating both high humidity and harsh chemicals.
It is important to ensure chip dryness after cleaning to prevent contamination and particle adhesion.